Patent Assignment
Reel/Frame 045060/0182
Assignment of Assignor's Interest
Recorded: 2018-02-28
Pages: 5
Assignors
LI, JING-WEI
Executed: 2018-02-26
CHEN, SHIN-WEN
Executed: 2018-02-26
LI, KUN
Executed: 2018-02-26
DING, SHENG-JIE
Executed: 2018-02-26
Assignees
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
B2 BUILDING, FOXCONN TECHNOLOGY GROUP,DONGHUAN 2ND ROAD,LONGHUA TOWN, SHENZHEN, CHINA
HON HAI PRECISION INDUSTRY CO., LTD.
66, CHUNG SHAN ROAD, TU-CHENG DIST., NEW TAIPEI, TAIWAN
Covered Property
(1)
Circuit Board, Manufacturing Method for Circuit Board and Camera Module
Application:
15/907,435 →
Publication:
US 2019/0246490
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.