Patent Assignment
Reel/Frame 045095/0561
Corrective Assignment to Correct the Eighth Assignee Name and Address Previously Recorded at Reel: 031174 Frame: 0452. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2018-01-19
Received: 2018-01-19
Pages: 21
Assignor
LAPIS SEMICONDUCTOR CO., LTD.
Executed: 2013-06-24
Assignees
OTSUKA, KANJI
HIGASHIYAMATO-SHI, KOHAN 2-1074-38, TOKYO, JPX, JAPAN
USAMI, TAMOTSU
KOKUBUN-SHI, NISHI-MACHI 2-38-4, TOKYO, JPX, JAPAN
ROHM CO., LTD
UKYO-KU 21, SAIIN MIZOSAKI-CHO, KYOTO, JPX, 615-8585, JAPAN
SANYO ELECTRIC CO., LTD.
MORIGUCHI-SHI 2-CHOME, 5-5 KEIHANHONDORI, OSAKA, JPX, JAPAN
SONY CORPORATION
6-CHOME, 7-35 KITASHINAGAWA, SHINAGAWA-KU, TOKYO, JPX, JAPAN
KABUSHIKI KAISHA TOSHIBA
MINATO-KU, 1-1 SHIBAURA 1-CHOME, TOKYO, JPX, JAPAN
NEC CORPORATION
MINATO-KU, 7-1 SHIBA 5-CHOME, TOKYO, JPX, JAPAN
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, JAPAN
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, JPX, 571-8501, JAPAN
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU, YOKOHAMA-SHI, KANAGAWA, JPX, 222-0033, JAPAN
Covered Properties
(2)
Method of Manufacturing Wiring Substrate Having Terminated Buses
Application:
11/440,113 →
Method of Terminating Bus, Bus Termination Resistor, and Wiring Substrate Having Terminated Buses and Method of Its Manufacture
Application:
10/079,464 →