Patent Assignment
Reel/Frame 045100/0906
Assignment of Assignor's Interest
Recorded: 2018-03-04
Pages: 6
Assignors
HSIAO, MIN-CHIEN
Executed: 2017-09-26
YU, CHEN-HUA
Executed: 2017-09-26
LIU, CHUNG-SHI
Executed: 2017-09-26
SHIH, CHAO-WEN
Executed: 2017-09-26
CHANG, SHOU-ZEN
Executed: 2018-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure, Electronic Device and Method of Fabricating Package Structure