Patent Assignment
Reel/Frame 045185/0646
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2018-03-13
Received: 2018-03-13
Pages: 3
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application
(1)
METHOD OF PACKAGING THIN DIE AND SEMICONDUCTOR DEVICE INCLUDING THIN DIE
App. No. 15/919,401
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