IP Library Assignment 045229/0371
Patent Assignment
Reel/Frame 045229/0371

Assignment of Assignor's Interest

Recorded: 2018-03-15 Pages: 4
Assignors
SHIRAHATA, TAKAHIRO
Executed: 2018-01-29
ORITA, HIROYUKI
Executed: 2018-01-29
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1 KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property (1)
Film Forming Device Including a Detachable Bottom Plate for Forming a Film on a Substrate
Application: 15/760,285 →
Publication: US 2018/0264498
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →