IP Library Assignment 045265/0493
Patent Assignment
Reel/Frame 045265/0493

Assignment of Assignor's Interest

Recorded: 2018-03-19 Pages: 2
Assignor
TEXAS INSTRUMENTS DEUTSCHLAND GMBH
Executed: 2018-03-05
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, MS 3999, DALLAS, TEXAS, 75243
Covered Property (1)
Metal Bond Pad with Cobalt Interconnect Layer and Solder Thereon
Patent: 9,960,135 →
Application: 14/665,799 →
Publication: US 2016/0284656
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 24, 2015
From: RINCK, HELMUT; BAUER, GERNOT; ZRILE, ROBERT; SCHACHTSCHNEIDER, KAI-ALEXANDER
To: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
Reel/Frame 035259/0335 →
Assignment of Assignor's Interest Feb 16, 2021
From: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
To: TEXAS INSTRUMENTS INCORPORATED
Reel/Frame 055314/0255 →