Patent Assignment
Reel/Frame 045332/0177
Assignment of Assignor's Interest
Recorded: 2018-03-23
Pages: 4
Assignors
KESER, LIZABETH
Executed: 2018-01-08
ORT, THOMAS
Executed: 2018-01-10
WAGNER, THOMAS
Executed: 2018-01-09
WAIDHAS, BERND
Executed: 2018-01-09
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Molded Substrate Package in Fan-Out Wafer Level Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.