Assignment of Assignor's Interest

Recorded: 2018-03-28 Pages: 8

Assignors

HUANG, KUN-YUNG

Executed: 2018-03-22

PAN, CHI-LIANG

Executed: 2018-03-26

CHENG, JING-HUA

Executed: 2018-03-26

TSENG, BIN-HUI

Executed: 2018-03-26

Assignee

POWERTECH TECHNOLOGY INC.

NO.26, DATONG RD., HUKOU TOWNSHIP,, HSINCHU COUNTY, 303, TAIWAN

Covered Property (1)

Semiconductor Package and Manufacturing Method Thereof

Patent: 10,276,545 →

Application: 15/936,444 →