Patent Assignment
Reel/Frame 045427/0743
Assignment of Assignor's Interest
Recorded: 2018-04-03
Pages: 3
Assignor
BAN, YURI
Executed: 2018-03-19
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Laser Processing Method of Wafer Using Plural Laser Beams