Patent Assignment
Reel/Frame 045471/0977
Assignment of Assignor's Interest
Recorded: 2018-02-28
Pages: 4
Assignors
HUANG, TZU-SUNG
Executed: 2018-02-07
LIN, HSIU-JEN
Executed: 2018-02-07
TSAI, HAO-YI
Executed: 2018-02-13
TSENG, MING HUNG
Executed: 2018-02-18
CHIANG, TSUNG-HSIEN
Executed: 2018-02-07
KUO, TIN-HAO
Executed: 2018-02-13
LIN, YEN-LIANG
Executed: 2018-02-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method