Patent Assignment
Reel/Frame 045499/0775
Assignment of Assignor's Interest
Recorded: 2018-04-11
Pages: 3
Assignors
ANDRE DE SAMBER, MARC
Executed: 2013-01-10
CORNELIS EGBERTUS VAN GRUNSVEN, ERIC
Executed: 2013-01-11
ANTOIN BASTIAAN ENGELEN, ROY
Executed: 2013-01-11
Assignee
KONINKLIJKE PHILIPS N.V.
HIGH TECH CAMPUS 5, EINDHOVEN, 5656 AE, NETHERLANDS
Covered Property
(1)
Low Warpage Wafer Bonding Through Use of Slotted Substrates
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
Assignment of Assignor's Interest
Apr 16, 2018
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 046635/0071 →
Security Interest
Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
Release of Security Interest
Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
Assignment of Assignor's Interest
Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →