Patent Assignment
Reel/Frame 045508/0797
Assignment of Assignor's Interest
Recorded: 2018-04-11
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device with Wider Sidewall Spacer for a High Voltage Misfet