IP Library › Assignment 045533/0211
Patent Assignment
Reel/Frame 045533/0211

Assignment of Assignor's Interest

Recorded: 2018-04-13 Pages: 5
Assignors
FU, YUNHUA
Executed: 2017-02-23
MIRABELLA, LUCIA
Executed: 2017-02-22
Assignee
SIEMENS CORPORATION
755 COLLEGE ROAD EAST, PRINCETON, NEW JERSEY, 08540
Covered Property (1)
System and Method for Optimizing Tool Paths Based on Thermal/Structural Simulations of a Part Being Produced via a 3D-Printer
Application: 15/768,127 →
Publication: US 2018/0314235
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 13, 2018
From: KOMZSIK, LOUIS
To: SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC.
Reel/Frame 045533/0155 →
Assignment of Assignor's Interest Apr 13, 2018
From: SIEMENS CORPORATION
To: SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC.
Reel/Frame 045533/0251 →
Change of Name Dec 3, 2019
From: SIEMENS PRODUCT LIFECYCLE MANAGEMENT SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 051171/0024 →