Patent Assignment
Reel/Frame 045623/0072
Assignment of Assignor's Interest
Recorded: 2018-04-24
Pages: 8
Assignors
MATTHIAS, SVEN
Executed: 2018-04-20
PAPADOPOULOS, CHARALAMPOS
Executed: 2018-04-20
CORVASCE, CHIARA
Executed: 2018-04-20
KOPTA, ARNOST
Executed: 2018-04-20
Assignee
ABB SCHWEIZ AG
BROWN BOVERI STRASSE 6, BADEN, 5400, SWITZERLAND
Covered Property
(1)
Power Semiconductor Device with Thick Top-Metal-Design and Method for Manufacturing Such Power Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 6, 2020
From: ABB SCHWEIZ AG
To: ABB POWER GRIDS SWITZERLAND AG
Reel/Frame 052916/0001 →
Change of Name
Dec 31, 2021
From: ABB POWER GRIDS SWITZERLAND AG
To: HITACHI ENERGY SWITZERLAND AG
Reel/Frame 058666/0540 →
Merger
Nov 13, 2023
From: HITACHI ENERGY SWITZERLAND AG
To: HITACHI ENERGY LTD
Reel/Frame 065549/0576 →