IP Library Assignment 045683/0807
Patent Assignment
Reel/Frame 045683/0807

Assignment of Assignor's Interest

Recorded: 2018-05-01 Pages: 3
Assignor
LEUTEN, TYLER
Executed: 2018-04-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Ball Interconnect Structures for Surface Mount Components
Application: 15/943,391 →
Publication: US 2019/0304886
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072549/0402 →