Patent Assignment
Reel/Frame 045747/0658
Assignment of Assignor's Interest
Recorded: 2018-05-08
Pages: 4
Assignors
KUO, CHE-CHUN
Executed: 2018-05-04
CHI, TAIYUN
Executed: 2018-05-04
CHEN, THOMAS
Executed: 2018-05-04
Assignee
SPEEDLINK TECHNOLOGY INC.
10050 N WOLFE ROAD, SUITE 240, CUPERTINO, CALIFORNIA, 95014
Covered Property
(1)
Impedance Compensation of Flip Chip Connection for Rf Communications
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 16, 2020
From: SPEEDLINK TECHNOLOGY INC.
To: SWIFTLINK TECHNOLOGIES INC.
Reel/Frame 053227/0623 →
Assignment of Assignor's Interest
Oct 4, 2021
From: SWIFTLINK TECHNOLOGIES INC.
To: SWIFTLINK TECHNOLOGIES CO., LTD.; SWIFTLINK TECHNOLOGIES INC.
Reel/Frame 057688/0813 →
Assignment of Assignor's Interest
Feb 15, 2023
From: SWIFTLINK TECHNOLOGIES CO., LTD.
To: SWIFTLINK TECHNOLOGIES INC.
Reel/Frame 062712/0282 →