Patent Assignment
Reel/Frame 045839/0321
Assignment of Assignor's Interest
Recorded: 2018-05-17
Pages: 5
Assignors
HU, IAN
Executed: 2018-04-25
WANG, MING-HAN
Executed: 2018-04-25
HSIEH, TSUN-LUNG
Executed: 2018-04-25
HUANG, CHIH-YI
Executed: 2018-04-26
HUNG, CHIH-PIN
Executed: 2018-04-27
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and a Method of Manufacturing the Same