Patent Assignment
Reel/Frame 045972/0227
Assignment of Assignor's Interest
Recorded: 2018-06-04
Pages: 6
Assignors
CHO, YONGHOE
Executed: 2018-04-30
SHIM, JONGBO
Executed: 2018-05-17
YEON, SEUNGHOON
Executed: 2018-04-30
LEE, WON IL
Executed: 2018-05-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Redistribution Lines and Methods of Manufacturing Semiconductor Devices Using the Same