IP Library › Assignment 046060/0628
Patent Assignment
Reel/Frame 046060/0628

Assignment of Assignor's Interest

Recorded: 2018-06-12 Pages: 5
Assignors
LOW, LIENENG
Executed: 2018-06-11
LIM, TECK WEE CHRISTOPHER
Executed: 2018-06-12
CHONG, WAI MUN
Executed: 2018-06-08
NG, WAN TAK
Executed: 2018-06-08
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2., SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Seal Ring Bonding Structures
Application: 16/006,385 →
Publication: US 2019/0378798
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 16, 2020
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
Reel/Frame 051828/0252 →