IP Library Assignment 046064/0392
Patent Assignment
Reel/Frame 046064/0392

Assignment of Assignor's Interest

Recorded: 2018-06-13 Pages: 4
Assignor
YUN, HUI SUK
Executed: 2017-11-10
Assignee
KOREA INSTITUTE OF MACHINERY & MATERIALS
156, GAJEONGBUK-RO, YUSEONG-GU, DAEJEON, 34103, KOREA, REPUBLIC OF
Covered Property (1)
3D Printing Device for Multiple Materials and 3D Printing Method for Multiple Materials
Application: 15/926,238 →
Publication: US 2018/0272608
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2021
From: KOREA INSTITUTE OF MACHINERY & MATERIALS
To: KOREA INSTITUTE OF MATERIALS SCIENCE
Reel/Frame 055137/0489 →