Patent Assignment
Reel/Frame 046217/0783
Assignment of Assignor's Interest
Recorded: 2018-06-27
Pages: 2
Assignors
KUME, TAKASHI
Executed: 2016-06-10
SHIMURA, TAKAHIRO
Executed: 2016-10-06
MATSUSHITA, AKIRA
Executed: 2016-10-06
FUJINO, SHINICHI
Executed: 2016-10-06
TAKAGI, YUSUKE
Executed: 2016-10-06
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, 312-8503, JAPAN
Covered Property
(1)
Power Semiconductor Module and Manufacturing Method of Power Semiconductor Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.