IP Library Assignment 046270/0334
Patent Assignment
Reel/Frame 046270/0334

Assignment of Assignor's Interest

Recorded: 2018-07-05 Pages: 9
Assignors
VERHEYEN, JOZEF
Executed: 2018-06-20
VALKENBORGS, BRAWLEY
Executed: 2018-06-25
CUYT, LUC
Executed: 2018-06-19
VAN VAERENBERGH, JONAS
Executed: 2018-06-18
SCHILLEBEECKX, FILIPS
Executed: 2018-07-02
Assignee
3D SYSTEMS, INC.
333 THREE D SYSTEMS CIRCLE, ROCK HILL, SOUTH CAROLINA, 29730
Covered Property (1)
Apparatus with a Module for the Layered Manufacture of a Product
Application: 16/001,578 →
Publication: US 2018/0345411
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
Release of Security Interest Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →