Patent Assignment
Reel/Frame 046384/0496
Assignment of Assignor's Interest
Recorded: 2018-07-18
Pages: 7
Assignors
ENG, MEOW KOON
Executed: 2007-08-28
CHIA, YONG POO
Executed: 2007-08-28
BOON, SUAN JEUNG
Executed: 2007-08-28
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Microelectronic Die Packages with Metal Leads, Including Metal Leads for Stacked Die Packages, and Associated Systems and Methods
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →