Patent Assignment
Reel/Frame 046414/0659
Assignment of Assignor's Interest
Recorded: 2018-07-20
Pages: 3
Assignor
LIN, YOU-WEI
Executed: 2018-02-27
Assignee
MSTAR SEMICONDUCTOR, INC.
4F-1, NO. 26, TAI-YUAN ST., CHUPEI, HSINCHU HSIEN, 302, TAIWAN
Covered Property
(1)
Chip Package Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.