Patent Assignment
Reel/Frame 046443/0695
Assignment of Assignor's Interest
Recorded: 2018-07-24
Pages: 6
Assignors
RUBIN, JOSHUA
Executed: 2018-07-23
CLEVENGER, LAWRENCE A.
Executed: 2018-07-22
ARVIN, CHARLES L.
Executed: 2018-07-23
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Multi-Chip Package Structure Having Chip Interconnection Bridge Which Provides Power Connections Between Chip and Package Substrate