IP Library Assignment 046550/0726
Patent Assignment
Reel/Frame 046550/0726

Assignment of Assignor's Interest

Recorded: 2018-08-03 Pages: 2
Assignors
KAMACHI, MASANAO
Executed: 2012-11-01
YOSHIMURA, KOSHI
Executed: 2012-11-07
Assignee
HITACHI METALS, LTD.
1-2-1, SHIBAURA, MINATO-KU,, TOKYO, 105-8614, JAPAN
Covered Property (1)
Method for Forming Electrolytic Copper Plating Film on Surface of Rare Earth Metal-Based Permanent Magnet
Application: 16/020,650 →
Publication: US 2018/0350519
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Jun 3, 2024
From: HITACHI METALS, LTD.
To: HITACHI, LTD.
Reel/Frame 067605/0821 →