Patent Assignment
Reel/Frame 046566/0590
Assignment of Assignor's Interest
Recorded: 2018-08-07
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-06-27
YEE, KUO-CHUNG
Executed: 2018-06-27
YU, CHUN-HUI
Executed: 2018-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Fabricating Semiconductor Package