IP Library Assignment 046676/0630
Patent Assignment
Reel/Frame 046676/0630

Assignment of Assignor's Interest

Recorded: 2018-08-23 Pages: 6
Assignors
CHENG, KAI-LEUNG LARRY
Executed: 2017-02-24
CHANG, CHIA-WEI WADE
Executed: 2017-02-24
VAN NUFFEL, CLAUDE T.
Executed: 2017-02-24
HUNG, CHANG WU
Executed: 2017-02-24
Assignee
TRINSEO EUROPE GMBH
ZUGERSTRASSE 231, HORGEN, CH-8810, SWITZERLAND
Covered Property (1)
Molded Structures of Polycarbonate Based Substrates Over Molded with Silicone Rubbers
Application: 16/078,271 →
Publication: US 2019/0031916
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Jan 17, 2025
From: TRINSEO EUROPE GMBH
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 069940/0035 →
Security Interest Jan 29, 2025
From: TRINSEO EUROPE GMBH
To: ALTER DOMUS (US) LLC
Reel/Frame 070048/0159 →
Security Interest Jan 29, 2025
From: TRINSEO EUROPE GMBH
To: ALTER DOMUS (US) LLC
Reel/Frame 070048/0204 →