Patent Assignment
Reel/Frame 046683/0098
Assignment of Assignor's Interest
Recorded: 2018-08-23
Pages: 6
Assignors
LIU, HAITAO
Executed: 2018-08-22
HUANG, GUANGYU
Executed: 2018-08-22
MOULI, CHANDRA V.
Executed: 2018-08-22
GODA, AKIRA
Executed: 2018-08-22
PANDEY, DEEPAK CHANDRA
Executed: 2018-08-23
KARDA, KAMAL M.
Executed: 2018-08-22
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Devices and Systems with String Drivers Including High Band Gap Material and Methods of Formation
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →