IP Library › Assignment 046737/0318
Patent Assignment
Reel/Frame 046737/0318

Assignment of Assignor's Interest

Recorded: 2018-08-29 Pages: 5
Assignor
Assignee
MIT SEMICONDUCTOR PTE LTD
BLK 5004 ANG MO KIO AVENUE 5, #03-12 TECHPLACE II, SINGAPORE, 569872, SINGAPORE
Covered Property (1)
System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector
Patent: 9,929,036 →
Application: 15/319,259 →
Publication: US 2017/0133259
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 19, 2016
From: KWONG, KIM MONE; LIM, KOK YEOW; MAO, ZHIQIANG
To: MANUFACTURING INTEGRATION TECHNOLOGY LTD
Reel/Frame 040662/0625 →
Assignment of Assignor's Interest Jul 21, 2023
From: MIT SEMICONDUCTOR PTE LTD
To: MIT SEMICONDUCTOR (TIAN JIN) CO., LTD
Reel/Frame 064338/0536 →