Patent Assignment
Reel/Frame 046769/0107
Assignment of Assignor's Interest
Recorded: 2018-08-31
Pages: 3
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property
(1)
Carrier Bond and Debond Using Self-Depolymerizing Polymer
Application:
16/119,414 →
Publication:
US 2020/0075384
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignor Name Previously Recorded at Reel: 046769 Frame: 0107. Assignor(S) Hereby Confirms the Assignment.
Sep 6, 2018
From: FAY, OWEN R.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047029/0774 →
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →