Patent Assignment
Reel/Frame 046777/0023
Assignment of Assignor's Interest
Recorded: 2018-09-04
Pages: 4
Assignors
WU, MING-CHI
Executed: 2018-07-17
FANG, CHUN-CHIEH
Executed: 2018-07-18
SU, BO-CHANG
Executed: 2018-07-23
TU, CHIEN NAN
Executed: 2018-07-18
YEH, YU-LUNG
Executed: 2018-07-18
LIN, KUN-YU
Executed: 2018-08-07
CHEN, SHIH-SHIUNG
Executed: 2018-07-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Deep Trench Isolation Structures Resistant to Cracking