Patent Assignment
Reel/Frame 046840/0668
Assignment of Assignor's Interest
Recorded: 2018-09-11
Pages: 8
Assignors
STREET, BRET K.
Executed: 2018-08-20
ZHOU, WEI
Executed: 2018-08-16
GAMBEE, CHRISTOPHER J.
Executed: 2018-09-07
HACKER, JONATHAN S.
Executed: 2018-08-09
LUO, SHIJIAN
Executed: 2018-08-20
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, BOISE, IDAHO, 83716
Covered Property
(1)
Die Features for Self-Alignment During Die Bonding
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →