Patent Assignment
Reel/Frame 046863/0688
Assignment of Assignor's Interest
Recorded: 2018-05-21
Pages: 3
Assignors
SEONG, JIN YONG
Executed: 2018-05-09
KANG, HO JUN
Executed: 2018-05-09
PARK, SANG BIN
Executed: 2018-05-09
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Chip, Package Device Having the Memory Chips, and Operating Method of Package Device