Patent Assignment
Reel/Frame 046866/0451
Assignment of Assignor's Interest
Recorded: 2018-09-13
Pages: 7
Assignors
KIM, CHANGOH
Executed: 2018-09-03
CHO, SUNGWON
Executed: 2018-09-03
PARK, KYOUNGHEE
Executed: 2018-09-11
YOON, INSANG
Executed: 2018-09-05
SHIM, IL KWON
Executed: 2018-08-13
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
EMI Shielding for Die Backside Exposed Flip Chip Package
Application:
62/717,415 →