Patent Assignment
Reel/Frame 046913/0536
Assignment of Assignor's Interest
Recorded: 2018-08-22
Pages: 8
Assignors
SIMSEK-EGE, ARZUM F.
Executed: 2018-08-16
YANG, GUANGJUN
Executed: 2018-08-15
WANG, KUO-CHEN
Executed: 2018-07-27
AKHTAR, MOHD KAMRAN
Executed: 2018-08-15
KOGE, KATSUMI
Executed: 2018-07-27
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Methods of Forming Semiconductor Devices, and Related Semiconductor Devices, Memory Devices, and Electronic Systems
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 1 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement
Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest
Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest
Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →