Patent Assignment
Reel/Frame 046933/0133
Assignment of Assignor's Interest
Recorded: 2018-09-20
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-08-23
YEE, KUO-CHUNG
Executed: 2018-08-22
YU, CHUN-HUI
Executed: 2018-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Having Redistribution Layer Structure with Protective Layer and Method of Fabricating the Same