Patent Assignment
Reel/Frame 047001/0054
Assignment of Assignor's Interest
Recorded: 2018-09-28
Pages: 6
Assignors
TAI, CHIH-HSUAN
Executed: 2018-08-10
TSAI, HAO-YI
Executed: 2018-08-10
HUANG, YU-CHIH
Executed: 2018-08-10
LIU, CHIA-HUNG
Executed: 2018-08-10
KUO, TING-TING
Executed: 2018-08-10
WU, BAN-LI
Executed: 2018-08-17
TSENG, YING-CHENG
Executed: 2018-08-10
LAI, CHI-HUI
Executed: 2018-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure, Package-on-Package Structure and Method of Fabricating the Same