Patent Assignment
Reel/Frame 047005/0326
Assignment of Assignor's Interest
Recorded: 2018-09-28
Pages: 5
Assignee
SIEMENS AKTIENGESELLSCHAFT
WERNER-VON-SIEMENS-STR. 1, MUNICH, 80333, GERMANY
Covered Property
(1)
Method for Modular Additive Manufacturing of a Component and a Component
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.