Patent Assignment
Reel/Frame 047009/0204
Assignment of Assignor's Interest
Recorded: 2018-09-28
Pages: 3
Assignee
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2, VILLACH, 9500, AUSTRIA
Covered Property
(1)
Semiconductor Wafer Dicing Crack Prevention Using Chip Peripheral Trenches