Patent Assignment
Reel/Frame 047133/0892
Assignment of Assignor's Interest
Recorded: 2018-10-11
Pages: 2
Assignors
CHEN, CHIEN-HSUN
Executed: 2018-10-03
WU, JIUN YI
Executed: 2018-10-03
LEE, CHIEN-HSUN
Executed: 2018-10-03
LIU, CHUNG-SHI
Executed: 2018-10-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Manufacturing Semiconductor Package with Connection Structures Including via Groups