Patent Assignment
Reel/Frame 047168/0391
Assignment of Assignor's Interest
Recorded: 2018-10-15
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2018-10-09
LEE, CHIEN-HSUN
Executed: 2018-10-01
WU, JIUN YI
Executed: 2018-09-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Electronics Card Including Multi-Chip Module