Patent Assignment
Reel/Frame 047218/0119
Assignment of Assignor's Interest
Recorded: 2018-10-18
Pages: 4
Assignors
O'REILLY MEEHAN, RUDI
Executed: 2018-09-19
AGARWAL, AKSHAT
Executed: 2018-10-11
JEFFERS, NICHOLAS M.
Executed: 2018-10-15
Assignee
NOKIA TECHNOLOGIES OY
KARAPORTTI 3, ESPOO, 02610, FINLAND
Covered Property
(1)
Package, and Method of Manufacturing a Package Comprising an Enclosure and an Integrated Circuit