Patent Assignment
Reel/Frame 047284/0805
Assignment of Assignor's Interest
Recorded: 2018-10-23
Pages: 2
Assignor
BAEK, JIN HO
Executed: 2018-09-27
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Printed Circuit Board, Multi-Chip Package Including the Semiconductor Chip and Printed Circuit Board, and Method of Manufacturing the Multi-Chip Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.