Patent Assignment
Reel/Frame 047303/0911
Assignment of Assignor's Interest
Recorded: 2018-10-25
Pages: 5
Assignees
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
B2 BUILDING FOXCONN TECHNOLOGY GROUP,DONGHUAN 2ND ROAD,LONGHUA TOWN, SHENZHEN, CHINA
HON HAI PRECISION INDUSTRY CO., LTD.
66, CHUNG SHAN ROAD, TU-CHENG DIST., NEW TAIPEI, TAIWAN
Covered Property
(1)
Encapsulation Structure for Image Sensor Chip and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.