Patent Assignment
Reel/Frame 047317/0700
Assignment of Assignor's Interest
Recorded: 2018-08-17
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2018-08-06
YEE, KUO-CHUNG
Executed: 2018-08-06
YU, CHUN-HUI
Executed: 2018-08-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU,, 30078, TAIWAN
Covered Property
(1)
Semiconductor Packages with Electromagnetic Interference Shielding Layer and Methods of Forming the Same