Patent Assignment
Reel/Frame 047321/0901
Assignment of Assignor's Interest
Recorded: 2018-10-25
Pages: 4
Assignors
YU, CHI-YANG
Executed: 2018-10-16
LEE, CHIEN-HSUN
Executed: 2018-10-16
LIANG, YU-MIN
Executed: 2018-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof