Patent Assignment
Reel/Frame 047323/0968
Assignment of Assignor's Interest
Recorded: 2018-10-26
Pages: 3
Assignors
KURITA, SATORU
Executed: 2018-08-22
HORI, TATSURO
Executed: 2018-08-21
ENDOH, KEIICHI
Executed: 2018-08-10
MIYOSHI, HIROMASA
Executed: 2018-08-10
Assignee
DOWA ELECTRONICS MATERIALS CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
Covered Property
(1)
Joining Material and Joining Method Using Same