Patent Assignment
Reel/Frame 047362/0777
Assignment of Assignor's Interest
Recorded: 2018-10-31
Pages: 4
Assignors
LIN, KENG-PING
Executed: 2018-10-22
OU YANG, TZU-MING
Executed: 2018-10-22
LI, SHU-MING
Executed: 2018-10-22
KUROKAWA, TETSUHARU
Executed: 2018-10-22
Assignee
WINBOND ELECTRONICS CORP.
NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof