Patent Assignment
Reel/Frame 047382/0751
Assignment of Assignor's Interest
Recorded: 2018-11-01
Pages: 4
Assignors
TSAI, KUO-CHIANG
Executed: 2018-10-05
SU, FU-HSIANG
Executed: 2018-10-05
YU, KE-JING
Executed: 2018-10-05
HWANG, CHIH-HONG
Executed: 2018-10-05
CHEN, JYH-HUEI
Executed: 2018-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Via Structure with Low Resistivity and Method for Forming the Same